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1.
公开(公告)号:US20190148268A1
公开(公告)日:2019-05-16
申请号:US16228378
申请日:2018-12-20
Applicant: Intel Corporation
Inventor: Omkar G. KARHADE , Nitin A. DESHPANDE , Rajendra C. DIAS , Edvin CETEGEN , Lars D. SKOGLUND
IPC: H01L23/485 , H01L23/00 , H01L21/56 , H01L23/498 , H01L25/065
Abstract: Underfill material flow control for reduced die-to-die spacing in semiconductor packages and the resulting semiconductor packages are described. In an example, a semiconductor apparatus includes first and second semiconductor dies, each having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a common semiconductor package substrate by a plurality of conductive contacts, the first and second semiconductor dies separated by a spacing. A barrier structure is disposed between the first semiconductor die and the common semiconductor package substrate and at least partially underneath the first semiconductor die. An underfill material layer is in contact with the second semiconductor die and with the barrier structure, but not in contact with the first semiconductor die.
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公开(公告)号:US20170269017A1
公开(公告)日:2017-09-21
申请号:US15075083
申请日:2016-03-18
Applicant: Intel Corporation
Inventor: Steven A. KLEIN , Rajendra C. DIAS , David C. MCCOY , Lars D. SKOGLUND , Vijay SUBRAMANIAN , Aleksander ALEKSOV , Pramod MALATKAR , Ravindranath V. MAHAJAN , Robert L. SANKMAN
IPC: G01N27/20
CPC classification number: G01N27/20 , G01L1/04 , G01L1/18 , G01L1/22 , G01N3/08 , G01N2033/0078 , G01N2033/0095 , G01N2203/0042 , G01N2203/0044 , G01N2203/0062
Abstract: Embodiments are generally directed to air bladder based mechanical testing for stretchable electronics. An embodiment of a system includes an inflatable bladder to apply mechanical force to a stretchable electronics device by the inflation and deflation of the inflatable bladder; a valve unit to control fluid pressure applied to the inflatable bladder; and a control unit to control inflation and deflation of the inflatable bladder.
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