公开(公告)号：US20250110301A1

公开(公告)日：2025-04-03

申请号：US18477836

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Saeed Fathololoumi ,  Reece Andrew DeFrees ,  Kelly Christopher Magruder ,  Harel Frish ,  John M. Heck ,  Ling Liao ,  David Chak Wang Hui ,  Sushrutha Reddy Gujjula

IPC: G02B6/42 ,  H01L23/00 ,  H01L23/367 ,  H01L25/16 ,  H01L25/18

Abstract: Technologies for thermal plugs in photonic integrated circuit (PIC) dies are disclosed. In an illustrative embodiment, several thermal plugs extend from contact pads in a PIC die, through a dielectric layer, to a waveguide layer. The thermal plugs can carry heat at a higher rate than the surrounding dielectric layer, increasing the heat transfer through the PIC die. The PIC die may be mounted on an electronic integrated circuit (EIC) die in an integrated circuit component. The PIC die can transfer heat from the EIC die, through the PIC die, and to another component such as an integrated heat spreader, lowering the temperature of the EIC die. The thermal plugs can increase the heat transfer through the PIC die.

公开(公告)号：US20220221743A1

公开(公告)日：2022-07-14

申请号：US17711922

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Sanjeev Gupta ,  Olufemi I. Dosunmu ,  Nikolai Fediakine ,  Jin Hong ,  David Chak Wang Hui ,  Christian Malouin ,  Meer Nazmus Sakib ,  Jianying Zhou

IPC: G02F1/025 ,  G02F1/01

Abstract: Techniques for termination for microring modulators are disclosed. In the illustrative embodiment, a microring modulator on a photonic integrated circuit (PIC) die is modulated by radiofrequency (RF) signals connected to electrodes across the microring modulator. A resistor is connected to each of the electrodes. The resistors both provide termination for the RF signals, preventing or reducing reflections, as well as forming part of a bias tee, allowing for a DC bias voltage to be applied across the electrodes.