公开(公告)号：US20200371385A1

公开(公告)日：2020-11-26

申请号：US16991993

申请日：2020-08-12

Applicant: Intel Corporation

Inventor： Siamak Amiralizadeh Asl ,  David Hui ,  Sanjeev Gupta

IPC: G02F1/035

Abstract: Embodiments of the present disclosure are directed to a photonic integrated circuit (PIC) that includes a micro-ring modulator (MRM) that is coupled with termination circuitry to reduce the reflection coefficient of the MRM when the PIC is electrically coupled to a driver. In embodiments, the termination circuitry may include one or more passive elements. Other embodiments may be described and/or claimed.

公开(公告)号：US20220221743A1

公开(公告)日：2022-07-14

申请号：US17711922

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Sanjeev Gupta ,  Olufemi I. Dosunmu ,  Nikolai Fediakine ,  Jin Hong ,  David Chak Wang Hui ,  Christian Malouin ,  Meer Nazmus Sakib ,  Jianying Zhou

IPC: G02F1/025 ,  G02F1/01

Abstract: Techniques for termination for microring modulators are disclosed. In the illustrative embodiment, a microring modulator on a photonic integrated circuit (PIC) die is modulated by radiofrequency (RF) signals connected to electrodes across the microring modulator. A resistor is connected to each of the electrodes. The resistors both provide termination for the RF signals, preventing or reducing reflections, as well as forming part of a bias tee, allowing for a DC bias voltage to be applied across the electrodes.

公开(公告)号：US20220221566A1

公开(公告)日：2022-07-14

申请号：US17707882

申请日：2022-03-29

Applicant: Intel Corporation

Inventor： Jin Hong ,  Jianying Zhou ,  Sanjeev Gupta ,  Syed S. Islam ,  Christian Malouin

IPC: G01S7/4913 ,  G01S7/481

Abstract: Filter circuitry is provided for use with a light detection and ranging (Lidar) device implemented using silicon photonics. The filter circuitry includes high-pass filter circuitry to receive a signal from a photodetector of the lidar device and attenuate a lower frequency portion of the signal, where the lower frequency portion of the signal is the result of optical back reflections within the lidar device.

公开(公告)号：US20220404474A1

公开(公告)日：2022-12-22

申请号：US17558201

申请日：2021-12-21

Applicant: Intel Corporation

Inventor： Eleanor Patricia Paras Rabadam ,  Guiyun Bai ,  Israel Petronius ,  Sushrutha Gujjula ,  Ronald L. Spreitzer ,  Kenneth Brown ,  Konstantin Matyuch ,  Boping Xie ,  Stephen Keele ,  Qifeng Wu ,  Ankur Agrawal ,  Jonathan Doylend ,  Sanjeev Gupta ,  Sam Khalili ,  Daniel Grodensky ,  Nan Kong Ng ,  Ron Friedman ,  Gal Dvoretzki

IPC: G01S7/481 ,  G01S17/931 ,  G02B6/42

Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

公开(公告)号：US20220400548A1

公开(公告)日：2022-12-15

申请号：US17555022

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Sanjeev Gupta ,  Jin Hong

IPC: H05K1/02 ,  G01S7/481

Abstract: Various embodiments disclosed relate to LiDAR systems. The present disclosure includes a method and assemblies for connection photonics modules to LiDAR systems. In an example, a connection assembly can include a system board, a flex printed circuit board (PCB) connected to the system board through an interface, a photonics integrated circuit die mounted on a first side of the flex PCB and an electronic integrated circuit die mounted on a second side of the flex PCB, opposite the first side.