公开(公告)号：US20200006169A1

公开(公告)日：2020-01-02

申请号：US16022528

申请日：2018-06-28

Applicant: Intel Corporation

Inventor： William WARREN ,  Taylor GAINES ,  Frederick ATADANA ,  Edvin CETEGEN ,  Vipul MEHTA ,  Hsin-Yu LI ,  Yuying WEI ,  Yang GUO ,  Ren ZHANG

IPC: H01L23/16 ,  H01L23/31

Abstract: A structure including a barrier is described. In embodiments, a micro-electronic component may have a first face and a second face, wherein the second face includes interconnect structures and is opposite the first face. A fill material, such as a capillary underfill material (CUF), may fill a gap between the micro-electronic component and the substrate and substantially surround the interconnect structures. In embodiments, a barrier structure may be located on the surface of the substrate and along a perimeter or outside perimeter of the micro-electronic component, wherein a height of the barrier structure exceeds a height of the fill material in at least a portion of an open region of the substrate to confine the fill material to an area bordered by the barrier structure.