公开(公告)号：US20210059073A1

公开(公告)日：2021-02-25

申请号：US17090624

申请日：2020-11-05

申请人： Intel Corporation

发明人： Gaurav Patankar ,  Ruander Cardenas ,  Mark MacDonald ,  Akhilesh P. Rallabandi

IPC分类号： H05K7/20

摘要： Heterogeneous heat pipe solutions provide both low thermal resistance and a high Qmax. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular power mode. Other heterogeneous heat pipe solutions comprise one or more heterogeneous heat pipes, each heterogeneous heat pipe having more than wick, each wick having a different set of wick characteristics (wick material, wick thickness, etc.). Heterogeneous heat pipes can provide a thermal management solution for processors over their full operating power range.

公开(公告)号：US20230290706A1

公开(公告)日：2023-09-14

申请号：US17693003

申请日：2022-03-11

申请人： Intel Corporation

发明人： Gaurav Patankar ,  Shankar Devasenathipathy ,  Krishna Vasanth Valavala

IPC分类号： H01L23/427 ,  H01L23/367 ,  H01L23/473

CPC分类号： H01L23/427 ,  H01L23/3672 ,  H01L23/473

摘要： A surplus liquid reservoir attached to a vapor chamber integrated heat spreader (IHS) and placed near a heat source on a heterogenous die. The vapor chamber integrated heat spreader (IHS) includes a main heat transfer portion that encloses a vapor channel, a first wick material, and a first working fluid. The surplus liquid reservoir is provided by a reservoir leg mechanically coupled, on a first side, to the main heat transfer portion, the reservoir leg has a reservoir portion with a second working fluid and second wick material that is in contact with the first wick material. The surplus liquid reservoir can either support a PL2 that is higher than a given vapor chamber Qmax for a significantly long time or increase the PL2 value to a significantly higher value.

公开(公告)号：US20210329816A1

公开(公告)日：2021-10-21

申请号：US17358271

申请日：2021-06-25

申请人： Intel Corporation

发明人： Gaurav Patankar ,  Ruander Cardenas ,  Mark Angus MacDonald ,  Jeff Ku

IPC分类号： H05K7/20

摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a heat pipe with a liquid reservoir. The heat pipe with a liquid reservoir can include a main heat transfer portion that includes wick material and a vapor channel and a reservoir portion that includes the wick material where the wick material in the reservoir portion occupies at least about fifteen percent more of a volume of the reservoir portion than a percentage of a volume that the wick material occupies in the main heat transfer portion. In an example, the reservoir portion holds surplus liquid that is used when the main heat transfer portion starts to experience dryout.