公开(公告)号：US20220416097A1

公开(公告)日：2022-12-29

申请号：US17358921

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： David Kohen ,  Kelly Magruder ,  Parastou Fakhimi ,  Zhi Li ,  Cung Tran ,  Wei Qian ,  Mark Isenberger ,  Mengyuan Huang ,  Harel Frish ,  Reece DeFrees ,  Ansheng Liu

IPC: H01L31/0232 ,  G02B6/12 ,  H01L31/105 ,  H01L31/107 ,  H01L31/18

Abstract: A photodetector structure over a partial length of a silicon waveguide structure within a photonic integrated circuit (PIC) chip. The photodetector structure is embedded within a cladding material surrounding the waveguide structure. The photodetector structure includes an absorption region, for example comprising Ge. A sidewall of the cladding material may be lined with a sacrificial spacer. After forming the absorption region, the sacrificial spacer may be removed and passivation material formed over a sidewall of the absorption region. Between the absorption region an impurity-doped portion of the waveguide structure there may be a carrier multiplication region, for example comprising crystalline silicon. If present, edge facets of the carrier multiplication region may be protected by a spacer material during the formation of an impurity-doped charge carrier layer. Occurrence of edge facets may be mitigated by embedding a portion of the photodetector structure with a thickness of the waveguide structure.

公开(公告)号：US10996408B2

公开(公告)日：2021-05-04

申请号：US16517159

申请日：2019-07-19

Applicant: Intel Corporation

Inventor： John Heck ,  Harel Frish ,  Reece DeFrees ,  George A. Ghiurcan ,  Hari Mahalingam ,  Pegah Seddighian

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/122

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.

公开(公告)号：US20190339466A1

公开(公告)日：2019-11-07

申请号：US16517159

申请日：2019-07-19

Applicant: Intel Corporation

Inventor： John Heck ,  Harel Frish ,  Reece DeFrees ,  George A. Ghiurcan ,  Hari Mahalingam ,  Pegah Seddighian

IPC: G02B6/42

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.