公开(公告)号：US11984246B2

公开(公告)日：2024-05-14

申请号：US17566529

申请日：2021-12-30

Applicant: Intel Corporation

Inventor： Andreas Wolter ,  Thorsten Meyer ,  Gerhard Knoblinger

IPC: H01F17/00 ,  H01F41/04 ,  H01L23/00 ,  H01L23/522 ,  H01L23/64 ,  H01F27/28

CPC classification number: H01F17/0033 ,  H01F41/046 ,  H01L23/5227 ,  H01L23/645 ,  H01L24/17 ,  H01F2017/0086 ,  H01F2027/2814 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/16265 ,  H01L2224/16267 ,  H01L2224/1703 ,  H01L2224/171 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2224/0345 ,  H01L2924/00014 ,  H01L2224/03462 ,  H01L2924/00014 ,  H01L2224/03464 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/11462 ,  H01L2924/00014 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/11334 ,  H01L2924/00014

Abstract: Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.

公开(公告)号：US11250981B2

公开(公告)日：2022-02-15

申请号：US16993152

申请日：2020-08-13

Applicant: Intel Corporation

Inventor： Andreas Wolter ,  Thorsten Meyer ,  Gerhard Knoblinger

IPC: H01L23/64 ,  H01F17/00 ,  H01F41/04 ,  H01L23/522 ,  H01L23/00 ,  H01F27/28

Abstract: Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.