专利检索 ap:("Intel Corporation") AND inv:"Guocheng ZHANG" 第 1 页

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发明申请
THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS 有权

公开(公告)号：US20220225542A1

公开(公告)日：2022-07-14

申请号：US17710640

申请日：2022-03-31

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM , Yi XIA , Ying-Feng PANG , Tong Wa CHAO , Mark BIANCO , Yanbing SUN , Ming ZHANG , Guixiang TAN , Devdatta P. KULKARNI , Guocheng ZHANG , Hao ZHOU

IPC分类号： H05K7/20 , G11C5/04

摘要： A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.