公开(公告)号：US20220210952A1

公开(公告)日：2022-06-30

申请号：US17697877

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Hardeep SINGH ,  Rachit SHARMA ,  Timothy Glen HANNA ,  Devdatta P. KULKARNI

IPC: H05K7/20 ,  H05K7/14

Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.

公开(公告)号：US20200245511A1

公开(公告)日：2020-07-30

申请号：US15754957

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Devdatta P. KULKARNI ,  Richard J. DISCHLER

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

Abstract: The present disclosure describes embodiments of apparatuses and methods related to a computing apparatus with a closed cooling loop thermally coupled to one or more processors disposed on a circuit board of the computing apparatus. The closed cooling loop circulates a dielectric fluid to absorb heat from the processor. A portion of the dielectric fluid is evaporated from the processor heat absorbed by the dielectric fluid. A heat exchanger is coupled to the circuit board and thermally coupled to the closed cooling loop. The heat exchanger is to include a coolant flow to remove heat from the dielectric fluid circulated through the portion of the closed cooling loop thermally coupled to the heat exchanger. A vapor portion of the dielectric fluid is condensed from the heat removed by the coolant flow. Other embodiments may be described and/or claimed.

公开(公告)号：US20250024647A1

公开(公告)日：2025-01-16

申请号：US18897793

申请日：2024-09-26

Applicant: Intel Corporation

Inventor： Hardeep SINGH ,  Rachit SHARMA ,  Timothy Glen HANNA ,  Devdatta P. KULKARNI

IPC: H05K7/20 ,  H05K7/14

Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.

公开(公告)号：US20220225542A1

公开(公告)日：2022-07-14

申请号：US17710640

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Tong Wa CHAO ,  Mark BIANCO ,  Yanbing SUN ,  Ming ZHANG ,  Guixiang TAN ,  Devdatta P. KULKARNI ,  Guocheng ZHANG ,  Hao ZHOU

IPC: H05K7/20 ,  G11C5/04

Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.

公开(公告)号：US20210321543A1

公开(公告)日：2021-10-14

申请号：US17357776

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Guixiang TAN ,  Xiang LI ,  Jimmy CHUANG ,  Devdatta P. KULKARNI ,  Casey WINKEL ,  Evan A. CHENELLY

IPC: H05K7/20 ,  G06F1/20 ,  G11C5/04

Abstract: An apparatus is described. The apparatus includes a module to be inserted into an electronic system. The module includes a first heat exchanger at one end of the module and second heat exchanger at another end of the module. The module also includes a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module. The first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.