公开(公告)号：US20240053281A1

公开(公告)日：2024-02-15

申请号：US17883678

申请日：2022-08-09

Applicant: Intel Corporation

Inventor： John Ferdinand MAGANA ,  Guojing ZHANG

IPC: G01N21/958

CPC classification number: G01N21/958 ,  G01N2201/0636

Abstract: The present disclosure is directed to a reticle assembly having a reticle and a pellicle attached to a pellicle support frame positioned on the reticle and includes a sensor assembly having optical and sensor components, which monitor the pellicle. The optical components and the sensor components of the sensor assembly may be coupled to a controller, which may be further coupled to one or more semiconductor process tools.

公开(公告)号：US20210026234A1

公开(公告)日：2021-01-28

申请号：US16521445

申请日：2019-07-24

Applicant: Intel Corporation

Inventor： John MAGANA ,  Guojing ZHANG ,  Yang CAO

IPC: G03F1/24 ,  G03F7/20

Abstract: Embodiments disclosed herein include EUV reticles and methods of forming such reticles. In an embodiment a method of forming an EUV reticle comprises providing a reticle, where the reticle comprises, a substrate, a mirror layer over the substrate, where the mirror layer comprises a plurality of first mirror layers and second mirror layers in an alternating pattern, and a capping layer over the mirror layer. In an embodiment, the method may further comprise disposing a first layer over the capping layer, patterning an opening in the first layer, and disposing a second layer in the opening, where the second layer is disposed with an electroless deposition process.

公开(公告)号：US20200050097A1

公开(公告)日：2020-02-13

申请号：US16059527

申请日：2018-08-09

Applicant: Intel Corporation

Inventor： John MAGANA ,  Guojing ZHANG

IPC: G03F1/22 ,  G03F1/54 ,  G03F7/20

Abstract: Embodiments disclosed herein include reticles for extreme ultraviolet (EUV) lithography and methods of forming such reticles. In an embodiment, the reticle may comprise a substrate and a mirror layer over the substrate. In an embodiment, the mirror layer includes alternating layers of a first mirror layer and a second mirror layer. In an embodiment, a fiducial may be formed into the mirror layer. In an embodiment, the fiducial comprises constituents of the first mirror layer and the second mirror layer. In an embodiment, an absorber layer may be formed over the mirror layer.

公开(公告)号：US20200033736A1

公开(公告)日：2020-01-30

申请号：US16045253

申请日：2018-07-25

Applicant: Intel Corporation

Inventor： Robert BRISTOL ,  Guojing ZHANG ,  Tristan TRONIC ,  John MAGANA ,  Chang Ju CHOI ,  Arvind SUNDARAMURTHY ,  Richard SCHENKER

IPC: G03F7/20 ,  G03F1/24

Abstract: Embodiments described herein comprise extreme ultraviolet (EUV) reticles and methods of forming EUV reticles. In an embodiment, the reticle may comprise a substrate and a mirror layer over the substrate. In an embodiment, the mirror layer comprises a plurality of alternating first mirror layers and second mirror layers. In an embodiment, a phase-shift layer is formed over the mirror layer. In an embodiment, openings for printable features and openings for non-printable features are formed into the phase-shift layer. In an embodiment, the non-printable features have a dimension that is smaller than a dimension of the printable features.