公开(公告)号：US20160260679A1

公开(公告)日：2016-09-08

申请号：US14430131

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Kabirkumar J. Mirpuri ,  Hongjin Jiang ,  Tyler N. Osborn ,  Rajen S. Sidhu ,  Ibrahim Bekar ,  Susheel G. Jadhav

IPC: H01L23/00

CPC classification number: H01L24/73 ,  H01L21/4867 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/0569 ,  H01L2224/11 ,  H01L2224/13014 ,  H01L2224/13026 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/29026 ,  H01L2224/29109 ,  H01L2224/29113 ,  H01L2224/73104 ,  H01L2224/92143 ,  H01L2924/014

Abstract: Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.

Abstract translation: 这里描述了与具有增加的z高度和降低的回流温度的互连相关的装置，工艺和系统。 在实施例中，互连可以包括焊球和焊膏以将焊球耦合到衬底。 焊球和/或焊膏可以由具有较低熔点的合金和具有较高熔点的合金构成。