公开(公告)号：US20210109883A1

公开(公告)日：2021-04-15

申请号：US17131404

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Jeffrey Erik Schulz ,  David W. Mendel ,  Dinesh D. Patil ,  Gary Brian Wallichs ,  Keith Duwel ,  Jacob Raymond Jones

IPC: G06F13/40 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  G06F13/42 ,  G06F13/38 ,  H03K19/173

Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.