公开(公告)号：US20220201889A1

公开(公告)日：2022-06-23

申请号：US17128620

申请日：2020-12-21

申请人： Intel Corporation

发明人： Raanan Sover ,  James Williams ,  Bradley Smith ,  Nir Peled ,  Paul George ,  Jason Armstrong ,  Alexey Chinkov ,  Meir Cohen ,  Je-Young Chang ,  Kuang Liu ,  Ravindranath Mahajan ,  Kelly Lofgreen ,  Kyle Arrington ,  Michael Crocker ,  Sergio Antonio Chan Arguedas

IPC分类号： H05K7/20

摘要： A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.