公开(公告)号：US20200315023A1

公开(公告)日：2020-10-01

申请号：US16363925

申请日：2019-03-25

Applicant: Intel Corporation

Inventor： Suddhasattwa NAD ,  Kassandra NIKKHAH ,  Joshua MICHALAK ,  Marcel WALL ,  Rahul MANEPALLI ,  Cemil GEYIK ,  Benjamin DUONG ,  Darko GRUJICIC

IPC: H05K3/10 ,  H01L23/538 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a first layer of a package substrate and a conductive trace over the first layer of the package substrate. In an embodiment, the conductive trace comprises a conductive body with a first surface over the first layer of the package substrate, a second surface opposite the first surface, and sidewall surfaces coupling the first surface to the second surface. In an embodiment, the second surface has a first roughness and the sidewall surfaces have a second roughness that is less than the first roughness.