公开(公告)号：US20240347590A1

公开(公告)日：2024-10-17

申请号：US18755306

申请日：2024-06-26

申请人： Intel Corporation

发明人： Bhaskar Jyoti Krishnatreya ,  Guruprasad Arakere ,  Nitin Ashok Deshpande ,  Mohammad Enamul Kabir ,  Omkar Gopalkrishna Karhade ,  Keith Edward Zawadzki ,  Trianggono S. Widodo

IPC分类号： H01L29/06 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/78 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L29/0657 ,  H01L21/78 ,  H01L23/562 ,  H01L25/0655 ,  H01L21/30625 ,  H01L21/3065 ,  H01L24/08 ,  H01L2224/08221

摘要： Systems, apparatus, articles of manufacture, and methods to reduce stress in integrated circuit packages are disclosed. An example semiconductor chip includes: a front surface; a back surface opposite the front surface; a first lateral surface extending between the front surface and the back surface; a second lateral surface extending between the front surface and the back surface; and a curved fillet at an intersection between the first lateral surface and the second lateral surface.