公开(公告)号：US09123724B2

公开(公告)日：2015-09-01

申请号：US14134097

申请日：2013-12-19

Applicant: Intel Corporation

Inventor： Xianghong Tong ,  Zhanping Chen ,  Walid M. Hafez ,  Zhiyong Ma ,  Sarvesh H. Kulkarni ,  Kevin X. Zhang ,  Matthew B. Pedersen ,  Kevin D. Johnson

IPC: H01L27/11 ,  H01L29/04 ,  H01L21/02 ,  H01L23/58 ,  H01L23/525 ,  H01L27/02 ,  H01L27/112 ,  H01L27/06 ,  H01L21/44 ,  H01L29/861

CPC classification number: H01L23/5252 ,  H01L21/44 ,  H01L27/0207 ,  H01L27/0629 ,  H01L27/11206 ,  H01L29/861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods of forming and using a microelectronic structure are described. Embodiments include forming a diode between a metal fuse gate and a PMOS device, wherein the diode is disposed between a contact of the metal fuse gate and a contact of the PMOS device, and wherein the diode couples the contact of the metal fuse gate to the contact of the PMOS device.

Abstract translation: 描述了形成和使用微电子结构的方法。 实施例包括在金属熔丝栅极和PMOS器件之间形成二极管，其中二极管设置在金属熔丝栅极的触点和PMOS器件的触点之间，并且其中二极管将金属熔丝栅极的触点耦合到 PMOS器件的接触。