公开(公告)号：US10475715B2

公开(公告)日：2019-11-12

申请号：US15037851

申请日：2015-06-17

Applicant: Intel Corporation

Inventor： Venmathy McMahan ,  Sivakumar Nagarajan ,  Elah Bozorg-Grayeli ,  Amrita Mallik ,  Kuang-Han Chu ,  Liwei Wang ,  Nisha Ananthakrishnan ,  Craig J. Weinman ,  Amram Eitan

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L21/56 ,  H01L23/18 ,  H01L23/373 ,  H01L25/065 ,  H01L25/07 ,  H01L23/00

Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.

公开(公告)号：US20170170088A1

公开(公告)日：2017-06-15

申请号：US15037851

申请日：2015-06-17

Applicant: Intel Corporation

Inventor： Venmathy McMahan ,  Sivakumar Nagarajan ,  Elah Bozorg-Grayeli ,  Amrita Mallik ,  Kuang-Han Chu ,  Liwei Wang ,  Nisha Ananthakrishnan ,  Craig J. Weinman ,  Amram Eitan

IPC: H01L23/29 ,  H01L23/18 ,  H01L23/31

Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.