公开(公告)号：US20170170088A1

公开(公告)日：2017-06-15

申请号：US15037851

申请日：2015-06-17

申请人： Intel Corporation

发明人： Venmathy McMahan ,  Sivakumar Nagarajan ,  Elah Bozorg-Grayeli ,  Amrita Mallik ,  Kuang-Han Chu ,  Liwei Wang ,  Nisha Ananthakrishnan ,  Craig J. Weinman ,  Amram Eitan

IPC分类号： H01L23/29 ,  H01L23/18 ,  H01L23/31

摘要： Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.

公开(公告)号：US10297567B2

公开(公告)日：2019-05-21

申请号：US14974823

申请日：2015-12-18

申请人： Intel Corporation

发明人： Donglai David Lu ,  Jimin Yao ,  Amrita Mallik ,  George S. Kostiew ,  Shawna M. Liff

IPC分类号： H01L23/00

摘要： Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.

公开(公告)号：US10475715B2

公开(公告)日：2019-11-12

申请号：US15037851

申请日：2015-06-17

申请人： Intel Corporation

发明人： Venmathy McMahan ,  Sivakumar Nagarajan ,  Elah Bozorg-Grayeli ,  Amrita Mallik ,  Kuang-Han Chu ,  Liwei Wang ,  Nisha Ananthakrishnan ,  Craig J. Weinman ,  Amram Eitan

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L21/56 ,  H01L23/18 ,  H01L23/373 ,  H01L25/065 ,  H01L25/07 ,  H01L23/00

摘要： Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.