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公开(公告)号：US20190391386A1
公开(公告)日：2019-12-26
申请号：US16464257
申请日：2016-12-27
Applicant: Intel Corporation
Inventor： Kyle Yazzie , Anna M. Prakash , Suriyakala Ramalingam , Liwei Wang , Robert Starkston , Arnab Choudhury , Sandeep S. Iyer , Amanuel M. Abebaw , Nick Labanok
Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.
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公开(公告)号：US11022792B2
公开(公告)日：2021-06-01
申请号：US16464257
申请日：2016-12-27
Applicant: Intel Corporation
Inventor： Kyle Yazzie , Anna M. Prakash , Suriyakala Ramalingam , Liwei Wang , Robert Starkston , Arnab Choudhury , Sandeep S. Iyer , Amanuel M. Abebaw , Nick Labanok
Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.
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公开(公告)号：US20190001342A1
公开(公告)日：2019-01-03
申请号：US15638167
申请日：2017-06-29
Applicant: Intel Corporation
Inventor： Amanuel M. Abebaw , Mark Saltas , Anna M. Prakash , Liwei Wang
Abstract: An apparatus for storing magnetic materials may include a tray. The apparatus for storing magnetic materials may include a sheet. The apparatus for storing magnetic materials may include a first set of height modulators. The apparatus for storing magnetic materials may include a diamagnetic material.The tray may include one or more pockets. The one or more pockets may be configured to receive a magnetic device. The sheet may be configured to couple with the tray. The sheet may be located adjacent to a bottom of the one or more pockets. The sheet may include the diamagnetic material. The sheet may include the first set of height modulators. The first set of height modulators may protrude from a surface of the sheet. The first set of height modulators may be configured to extend into the one or more pockets at a first distance.
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公开(公告)号：US11670561B2
公开(公告)日：2023-06-06
申请号：US16721802
申请日：2019-12-19
Applicant: Intel Corporation
Inventor： Zhimin Wan , Chandra Mohan Jha , Je-Young Chang , Chia-Pin Chiu , Liwei Wang
IPC: H01L23/367 , H01L23/31 , H01L23/373 , H01L23/42 , H01L23/538 , H01L25/065 , H01L25/18 , H01L21/48 , H01L21/56 , H01L25/00
CPC classification number: H01L23/367 , H01L21/4853 , H01L21/56 , H01L23/3157 , H01L23/373 , H01L23/3736 , H01L23/42 , H01L23/5386 , H01L25/0655 , H01L25/50
Abstract: Embodiments include semiconductor packages and a method to form such packages. A semiconductor package includes first, second, and third microelectronic devices on a package substrate. The first microelectronic device has a top surface substantially coplanar to a top surface of the second microelectronic device. The third microelectronic device has a top surface above the top surfaces of the first and second microelectronic devices. The semiconductor package includes a first conductive layer on the first and second microelectronic devices, and a second conductive layer on the third microelectronic device. The second conductive layer has a thickness less than a thickness of the first conductive layer, and a top surface substantially coplanar to a top surface of the first conductive layer. The semiconductor includes thermal interface materials on the first and second conductive layers. The first and second conductive layers are comprised of copper, silver, boron nitride, or graphene.
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公开(公告)号：US10315200B2
公开(公告)日：2019-06-11
申请号：US15638167
申请日：2017-06-29
Applicant: Intel Corporation
Inventor： Amanuel M Abebaw , Mark Saltas , Anna M. Prakash , Liwei Wang
Abstract: An apparatus for storing magnetic materials may include a tray. The apparatus for storing magnetic materials may include a sheet. The apparatus for storing magnetic materials may include a first set of height modulators. The apparatus for storing magnetic materials may include a diamagnetic material. The tray may include one or more pockets. The one or more pockets may be configured to receive a magnetic device. The sheet may be configured to couple with the tray. The sheet may be located adjacent to a bottom of the one or more pockets. The sheet may include the diamagnetic material. The sheet may include the first set of height modulators. The first set of height modulators may protrude from a surface of the sheet. The first set of height modulators may be configured to extend into the one or more pockets at a first distance.
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Patent Agency Ranking
公开(公告)号：US20170170088A1
公开(公告)日：2017-06-15
申请号：US15037851
申请日：2015-06-17
Applicant: Intel Corporation
Inventor： Venmathy McMahan , Sivakumar Nagarajan , Elah Bozorg-Grayeli , Amrita Mallik , Kuang-Han Chu , Liwei Wang , Nisha Ananthakrishnan , Craig J. Weinman , Amram Eitan
Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.
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公开(公告)号：US11804470B2
公开(公告)日：2023-10-31
申请号：US16548255
申请日：2019-08-22
Applicant: Intel Corporation
Inventor： Xavier F. Brun , Kaizad Mistry , Paul R. Start , Nisha Ananthakrishnan , Yawei Liang , Jigneshkumar P. Patel , Sairam Agraharam , Liwei Wang
IPC: H01L25/065 , H01L25/00 , H01L23/367 , H01L23/29 , H01L23/31 , H01L23/00 , H01L25/18 , H01L23/48 , H01L21/56
CPC classification number: H01L25/0655 , H01L21/561 , H01L23/291 , H01L23/3135 , H01L23/3675 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L25/18 , H01L25/50 , H01L23/481 , H01L2224/16145 , H01L2224/29186 , H01L2224/32145 , H01L2224/73253
Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a plurality of first dies on a substrate, an encapsulation layer over the first dies and the substrate, an interface layer over the first dies and the encapsulation layer, and a passive heat spreader on the interface layer, wherein the interface layer thermally couples the first dies to the passive heat spreader. The passive heat spreader includes a silicon (Si) or a silicon carbide (SiC). The interface layer includes a silicon nitride (SiN) material, a silicon monoxide (SiO) material, a silicon carbon nitride (SiCN) material, or a thermal adhesive material. The semiconductor package may include a plurality of second dies and the substrate on a package substrate, a thermal interface material (TIM) over the second dies, the passive heat spreader, and the package substrate, and a heat spreader over the TIM and the package substrate.
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公开(公告)号：US20180134547A1
公开(公告)日：2018-05-17
申请号：US15354761
申请日：2016-11-17
Applicant: Intel Corporation
Inventor： Robert Starkston , Amanuel M. Abebaw , Liwei Wang , Mark Saltas , Sandeep S. Iyer , Nick Labanok
CPC classification number: B81C1/00182 , B29C65/14 , B29C65/4805 , B29L2031/34 , B81B3/0032 , B81B3/0051 , B81B3/0054 , B81B3/0059 , B81B3/0062 , B81B2201/038 , B81B2201/042 , B81B2203/0163 , B81B2203/051 , B81C2203/032
Abstract: Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.
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公开(公告)号：US10475715B2
公开(公告)日：2019-11-12
申请号：US15037851
申请日：2015-06-17
Applicant: Intel Corporation
Inventor： Venmathy McMahan , Sivakumar Nagarajan , Elah Bozorg-Grayeli , Amrita Mallik , Kuang-Han Chu , Liwei Wang , Nisha Ananthakrishnan , Craig J. Weinman , Amram Eitan
IPC: H01L23/29 , H01L23/31 , H01L23/48 , H01L21/56 , H01L23/18 , H01L23/373 , H01L25/065 , H01L25/07 , H01L23/00
Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.
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公开(公告)号：US10125013B2
公开(公告)日：2018-11-13
申请号：US15354761
申请日：2016-11-17
Applicant: Intel Corporation
Inventor： Robert Starkston , Amanuel M. Abebaw , Liwei Wang , Mark Saltas , Sandeep S. Iyer , Nick Labanok
Abstract: Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.
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