公开(公告)号：US20230361802A1

公开(公告)日：2023-11-09

申请号：US18029932

申请日：2020-11-03

Applicant: Intel Corporation

Inventor： Jayprakash THAKUR ,  Ofir DEGANI ,  Ronen KRONFELD ,  Ehud RESHEF ,  Seong-Youp J. SUH ,  Tal SHOSHANA ,  Eytan MANN ,  Maruti TAMRAKAR ,  Ashoke RAVI ,  Jose Rodrigo CAMACHO PEREZ ,  Timo Sakari HUUSARI ,  Eli BOROKHOVICH ,  Amir RUBIN ,  Ofer BENJAMIN ,  Tae Young YANG ,  Harry SKINNER ,  Kwan ho LEE ,  Jaejin LEE ,  Dong-Ho Han ,  Shahar GROSS ,  Eran SEGEV ,  Telesphor KAMGAING

IPC: H04B1/40

CPC classification number: H04B1/40

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.