公开(公告)号：US20220294109A1

公开(公告)日：2022-09-15

申请号：US17754149

申请日：2019-12-27

Applicant: INTEL CORPORATION

Inventor： Denica LARSEN ,  Dong-Ho HAN ,  Kwan Ho LEE ,  Shantanu KULKARNI ,  Jaejin LEE

IPC: H01Q1/52 ,  H01Q1/24 ,  H01Q9/28 ,  H01Q9/42

Abstract: An electronic computing device with a self-shielding antenna. An electronic computing device may include a frame, an antenna, and an antenna shielding. The frame includes a top cover and a bottom cover. Electronic components are included in a space formed between the top cover and the bottom cover. The antenna is for wireless transmission and reception and included in the frame near an edge of the frame. The antenna shielding is disposed around the antenna for providing electro-magnetic shielding from radio frequency (RE) noises generated from the electronic components included in the frame. The antenna shielding may be a metal wall disposed between the top cover and the bottom cover around the antenna. The frame may be a metallic frame and may include a cut-out in the top cover and the bottom cover above and below the antenna, and a non-metallic cover may be provided in the cut-out.

公开(公告)号：US20190393165A1

公开(公告)日：2019-12-26

申请号：US16481031

申请日：2017-03-30

Applicant: Intel Corporation

Inventor： Kaladhar RADHAKRISHNAN ,  Jaejin LEE ,  Hao-Han HSU ,  Chung-Hao J. CHEN ,  Dong-Ho HAN

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/18 ,  H05K1/18 ,  H01L21/48

Abstract: Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.

公开(公告)号：US20190229473A1

公开(公告)日：2019-07-25

申请号：US16370665

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Jaejin LEE ,  Jun LIAO ,  Xiang LI ,  Christopher E. COX

IPC: H01R13/6595 ,  H01R13/6581 ,  H05K9/00 ,  H01R12/72 ,  H05K1/11

Abstract: A device includes a printed circuit board (PCB) and a shield for the PCB. The shield can reduce high frequency electromagnetic frequency (EMF) noise generated by one or more components of the PCB. The PCB includes pads to interface with a corresponding connector. For example, for a dual inline memory module (DIMM) PCB, the PCB includes pads to insert into a DIMM connector. The shield includes a gap in its perimeter that aligns with clips in the corresponding connector. The gaps will correspond to similar features of the PCB that interface with the corresponding connector to allow the shield to attach to the PCB. The shield includes lock fingers to extend from a connector-facing edge of the shield to interface with the corresponding connector to align the shield with the corresponding connector.

公开(公告)号：US20230361802A1

公开(公告)日：2023-11-09

申请号：US18029932

申请日：2020-11-03

Applicant: Intel Corporation

Inventor： Jayprakash THAKUR ,  Ofir DEGANI ,  Ronen KRONFELD ,  Ehud RESHEF ,  Seong-Youp J. SUH ,  Tal SHOSHANA ,  Eytan MANN ,  Maruti TAMRAKAR ,  Ashoke RAVI ,  Jose Rodrigo CAMACHO PEREZ ,  Timo Sakari HUUSARI ,  Eli BOROKHOVICH ,  Amir RUBIN ,  Ofer BENJAMIN ,  Tae Young YANG ,  Harry SKINNER ,  Kwan ho LEE ,  Jaejin LEE ,  Dong-Ho Han ,  Shahar GROSS ,  Eran SEGEV ,  Telesphor KAMGAING

IPC: H04B1/40

CPC classification number: H04B1/40

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.

公开(公告)号：US20200219825A1

公开(公告)日：2020-07-09

申请号：US16824544

申请日：2020-03-19

Applicant: Intel Corporation

Inventor： Jaejin LEE ,  Christopher E. COX ,  Jun LIAO ,  Xiang LI

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

Abstract: A memory device includes a grounded molding. The memory device includes a substrate having a first surface for a memory die, where the substrate has ground vias through substrate to connect to a ground reference. The substrate has a ball grid array (BGA) on the opposite surface, including perimeter balls to connect to ground connections. The grounded molding includes an electrically conductive epoxy mold to cover the memory die, where the electrical conductivity of the molding, with the molding grounded can provide radio frequency interference (RFI) shielding.