公开(公告)号：US20240214022A1

公开(公告)日：2024-06-27

申请号：US18145860

申请日：2022-12-23

Applicant: Intel Corporation

Inventor： Vamshi Krishna AAGIRU ,  Santhosh AP ,  Praveen Kashyap Ananta BHAT ,  Arjun C ,  Shailendra Singh CHAUHAN ,  Sajal Kumar DAS ,  Walid EL HAJJ ,  Isha GARG ,  Sagar GUPTA ,  Mallari HANCHATE ,  Mythili HEGDE ,  Siva Prasad JANGILI GANGA ,  Satyajit Siddharay KAMAT ,  Noam KOGOS ,  Ronen KRONFELD ,  Adiel LANGER ,  Gil MEYUHAS ,  Padmesh MURUGAN LATHA ,  Vishram Shriram PANDIT ,  Abhijith PRABHA ,  Manisha RAIGURU ,  Ehud RESHEF ,  Amir RUBIN ,  Shubham Kumar SAHU ,  Gurpreet SANDHU ,  Michael SHACHAR ,  Harry SKINNER ,  Madhukiran SRINIVASAREDDY ,  Gokul SUBRAMANIAM ,  Maruti TAMRAKAR ,  Jayprakash THAKUR ,  Vijaya Prasad UMMELLA ,  Yagnesh Vinodrai WAGHELA

IPC: H04B1/3827 ,  H04W52/36

CPC classification number: H04B1/3838 ,  H04W52/365 ,  H04B2001/3844

Abstract: Various principles and methods are described herein to improve wireless communication in a user computing device. Certain aspects of the disclosure describe management of wireless transmissions relative to various regulations related to a specific absorption rate. Other aspects of the disclosure relate to detection of user proximity to a transmitting antenna. Other aspects relate to alternative strategies to improve wireless communication, such as selection of alternate antennas or baseband modems, or changes in device orientation.

公开(公告)号：US20220353650A1

公开(公告)日：2022-11-03

申请号：US17535697

申请日：2021-11-26

Applicant: Intel Corporation

Inventor： Carlos ALDANA ,  Biljana BADIC ,  Dave CAVALCANTI ,  Debabani CHOUDHURY ,  Christian DREWES ,  Jong-Kae FWU ,  Bertram GUNZELMANN ,  Nageen HIMAYAT ,  Ingolf KARLS ,  Duncan KITCHIN ,  Markus Dominik MUECK ,  Bernhard RAAF ,  Domagoj SIPRAK ,  Harry SKINNER ,  Christopher STOBART ,  Shilpa TALWAR ,  Zhibin YU

IPC: H04W4/40 ,  H04W4/80 ,  H04W8/00 ,  H04W28/22 ,  H04W36/00 ,  H04W36/08 ,  H04W48/16 ,  H04W72/04 ,  H04W12/069

Abstract: Disclosed herein is a communication device for vehicular radio communications. The communication device includes one or more processors configured to identify a plurality of vehicular communication devices that form a cluster of cooperating vehicular communication devices. The one or more processors also determine channel resource allocations for the plurality of vehicular communication devices that includes channel resources allocated for a first vehicular radio communication technology and channel resources allocated for a second vehicular radio communication technology. The one or more processors also transmit the channel resource allocation to the plurality of vehicular communication devices.

公开(公告)号：US20220352622A1

公开(公告)日：2022-11-03

申请号：US17762749

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Debabani CHOUDHURY ,  Jose Rodrigo CAMACHO PEREZ ,  Shuhei YAMADA ,  Vida Ilderem BURGER ,  Bryce D. HORINE ,  Harry SKINNER

IPC: H01Q1/32 ,  H01Q3/34 ,  B60Q1/00

Abstract: Various antennas elements including antennas arrays can support various communication technologies and can be integrated into different components or subcomponents of a vehicle, including various vehicle light assemblies. The vehicular antennas elements include low profile and/or concealed antenna elements that are inconspicuous aesthetically and do not affect or substantially affect vehicle aerodynamics.

公开(公告)号：US20250046983A1

公开(公告)日：2025-02-06

申请号：US18361952

申请日：2023-07-31

Applicant: Intel Corporation

Inventor： Bala SUBRAMANYA ,  Prakash KURMA RAJU ,  Jayprakash THAKUR ,  Zaman Zaid MULLA ,  Praveen KUMAR ,  Yagnesh Vinodrai WAGHELA ,  Maruti TAMRAKAR ,  Prasanna PICHUMANI ,  Harry SKINNER

IPC: H01Q1/22 ,  H01Q1/40 ,  H01Q1/48 ,  H01Q1/52

Abstract: Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

公开(公告)号：US20230361802A1

公开(公告)日：2023-11-09

申请号：US18029932

申请日：2020-11-03

Applicant: Intel Corporation

Inventor： Jayprakash THAKUR ,  Ofir DEGANI ,  Ronen KRONFELD ,  Ehud RESHEF ,  Seong-Youp J. SUH ,  Tal SHOSHANA ,  Eytan MANN ,  Maruti TAMRAKAR ,  Ashoke RAVI ,  Jose Rodrigo CAMACHO PEREZ ,  Timo Sakari HUUSARI ,  Eli BOROKHOVICH ,  Amir RUBIN ,  Ofer BENJAMIN ,  Tae Young YANG ,  Harry SKINNER ,  Kwan ho LEE ,  Jaejin LEE ,  Dong-Ho Han ,  Shahar GROSS ,  Eran SEGEV ,  Telesphor KAMGAING

IPC: H04B1/40

CPC classification number: H04B1/40

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.