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1.发明申请公开(公告)号：US20160280535A1
公开(公告)日：2016-09-29
申请号：US14671549
申请日：2015-03-27
Applicant: Intel Corporation
Inventor： Kyu Oh Lee , Zheng Zhou , Islam A. Salama , Feras Eid , Sasha N. Oster , Lay Wai Kong , Javier Soto Gonzalez
CPC classification number: B81B7/0077 , B81C2203/0109
Abstract: Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.
Abstract translation: 描述形成传感器集成封装器件和由此形成的结构的方法。 一个实施例包括提供衬底芯，其中第一导电迹线结构和第二导电迹线结构设置在衬底芯上，在第一导电迹线结构和第二导电迹线结构之间形成空腔，并将磁体放置在抗蚀剂上 设置在第一和第二导电迹线结构中的每一个的一部分上的材料，其中抗蚀剂材料不在空腔上延伸。
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公开(公告)号：US20220188028A1
公开(公告)日：2022-06-16
申请号：US17430693
申请日：2020-03-12
Applicant: Intel Corporation
Inventor： Michael P. Mesnier , John S. Keys , Ian F. Adams , Yi Zou , Luis Carlos Maria Remis , Daniel Robert McLeran , Mariusz Barczak , Arun Raghunath , Lay Wai Kong
IPC: G06F3/06
Abstract: In one embodiment, a system comprises a host processor and a storage system. The storage system comprises one or more storage devices, and each storage device comprises a non-volatile memory and a compute offload controller. The non-volatile memory stores data, and the compute offload controller performs compute tasks on the data based on compute offload commands from the host processor.
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公开(公告)号：US12282683B2
公开(公告)日：2025-04-22
申请号：US17430693
申请日：2020-03-12
Applicant: Intel Corporation
Inventor： Michael P. Mesnier , John S. Keys , Ian F. Adams , Yi Zou , Luis Carlos Maria Remis , Daniel Robert McLeran , Mariusz Barczak , Arun Raghunath , Lay Wai Kong
IPC: G06F3/06
Abstract: In one embodiment, a system comprises a host processor and a storage system. The storage system comprises one or more storage devices, and each storage device comprises a non-volatile memory and a compute offload controller. The non-volatile memory stores data, and the compute offload controller performs compute tasks on the data based on compute offload commands from the host processor.
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4.发明授权公开(公告)号：US09505607B2
公开(公告)日：2016-11-29
申请号：US14671549
申请日：2015-03-27
Applicant: Intel Corporation
Inventor： Kyu Oh Lee , Zheng Zhou , Islam A. Salama , Feras Eid , Sasha N. Oster , Lay Wai Kong , Javier Soto Gonzalez
CPC classification number: B81B7/0077 , B81C2203/0109
Abstract: Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.
Abstract translation: 描述形成传感器集成封装器件和由此形成的结构的方法。 一个实施例包括提供衬底芯，其中第一导电迹线结构和第二导电迹线结构设置在衬底芯上，在第一导电迹线结构和第二导电迹线结构之间形成空腔，并将磁体放置在抗蚀剂上 设置在第一和第二导电迹线结构中的每一个的一部分上的材料，其中抗蚀剂材料不在空腔上延伸。
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