公开(公告)号：US20190074252A1

公开(公告)日：2019-03-07

申请号：US16079105

申请日：2016-03-24

Applicant: Intel Corporation

Inventor： Sruti Chigullapalli ,  Leslie Fitch ,  Boping Wu

IPC: H01L23/552 ,  H01L23/10 ,  H01L23/367 ,  H01L23/60

CPC classification number: H01L23/552 ,  H01L23/10 ,  H01L23/367 ,  H01L23/42 ,  H01L23/49827 ,  H01L23/60 ,  H01L25/065 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/73253 ,  H05K7/20409 ,  H05K9/0015 ,  H05K9/0032

Abstract: An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.

公开(公告)号：US10763218B2

公开(公告)日：2020-09-01

申请号：US16079105

申请日：2016-03-24

Applicant: Intel Corporation

Inventor： Sruti Chigullapalli ,  Leslie Fitch ,  Boping Wu

IPC: H01L23/552 ,  H01L23/60 ,  H01L23/10 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H05K9/00 ,  H05K7/20 ,  H01L23/42

Abstract: An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.