公开(公告)号：US20250089192A1

公开(公告)日：2025-03-13

申请号：US18961017

申请日：2024-11-26

Applicant: Intel Corporation

Inventor： Phil Geng ,  Dongwang Chen ,  Fernando Gonzalez Lenero ,  Chuansheng Liu ,  Lejie Liu ,  Ralph V. Miele ,  Mohanraj Prabhugoud ,  Sanjoy Saha ,  David Shia ,  Jeffory L. Smalley ,  Ke Song ,  Meng Wang ,  Xiaoning Ye ,  Juan Zermeno Carriedo ,  Yipeng Zhong

IPC: H05K5/02 ,  H05K5/04

Abstract: Composite backplate architectures for backside power delivery and associated methods are disclosed. An example backplate includes a first layer including a first material, and a second layer attached to the first layer. The second layer includes a second material different from the first material. The example backplate further includes a bus bar attached to the first layer.