公开(公告)号：US20220105954A1

公开(公告)日：2022-04-07

申请号：US17430400

申请日：2019-03-12

Applicant: Intel Corporation

Inventor： Fei Li ,  Wenlong Yang ,  Jiao Zuo ,  Chuansheng Liu ,  Changcheng Liu ,  Zhuangzhi Li ,  Zhen Han

IPC: B60W60/00 ,  B60W30/165 ,  H04W4/46

Abstract: Systems, apparatuses and methods may provide for technology that sends first operation instructions to a first platoon of autonomous vehicles positioned behind a first lead vehicle, wherein the first operation instructions correspond to a manual operation of the first lead vehicle. The technology may also establish a direct communications link between the first lead vehicle and a second lead vehicle positioned ahead of the first lead vehicle, wherein the second lead vehicle is to be associated with a second platoon of autonomous vehicles. Additionally, the technology broadcasts second operation instructions from the direct communications link to the first platoon of autonomous vehicles while the first lead vehicle is in an autonomous mode, wherein the second operation instructions correspond to a manual operation of the second lead vehicle. The technology may also discontinue the direct communications link between the first lead vehicle and the second lead vehicle.

公开(公告)号：US20250089192A1

公开(公告)日：2025-03-13

申请号：US18961017

申请日：2024-11-26

Applicant: Intel Corporation

Inventor： Phil Geng ,  Dongwang Chen ,  Fernando Gonzalez Lenero ,  Chuansheng Liu ,  Lejie Liu ,  Ralph V. Miele ,  Mohanraj Prabhugoud ,  Sanjoy Saha ,  David Shia ,  Jeffory L. Smalley ,  Ke Song ,  Meng Wang ,  Xiaoning Ye ,  Juan Zermeno Carriedo ,  Yipeng Zhong

IPC: H05K5/02 ,  H05K5/04

Abstract: Composite backplate architectures for backside power delivery and associated methods are disclosed. An example backplate includes a first layer including a first material, and a second layer attached to the first layer. The second layer includes a second material different from the first material. The example backplate further includes a bus bar attached to the first layer.

公开(公告)号：US11106256B2

公开(公告)日：2021-08-31

申请号：US16648595

申请日：2018-01-12

Applicant: Intel Corporation

Inventor： Tao Shu ,  Chuansheng Liu ,  Na Chen ,  Liguang Du

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide cooling to a heat source. In embodiments, a first set of cooling fins are thermally coupled to a heat source in a first orientation to allow first airflow to pass through in between the first set of cooling fins to dissipate heat from the heat source. A second set of cooling fins thermally coupled to the heat source in a second orientation to allow second airflow to pass through in between the second set of cooling fins to dissipate heat from the heat source. A barrier may be coupled to the second set of cooling fins to substantially divert the second airflow away from the first airflow about to pass through in between the first set of cooling fins so that pre-heated air does not flow over the first set of cooling fins.