公开(公告)号：US11811182B2

公开(公告)日：2023-11-07

申请号：US16157184

申请日：2018-10-11

Applicant: Intel Corporation

Inventor： Tyler Leuten ,  Mohammed Rahman ,  Bilal Khalaf

IPC: H01R4/58 ,  H01L23/498 ,  H05K1/18 ,  H01R4/04 ,  H01R4/48 ,  H05K3/32 ,  H01R43/027

CPC classification number: H01R4/58 ,  H01L23/49816 ,  H01L23/49866 ,  H01R4/04 ,  H01R4/48 ,  H05K1/181 ,  H05K3/321 ,  H05K3/325 ,  H01R43/027 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2201/10734 ,  H05K2201/10909

Abstract: Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material that are woven on themselves to form a mesh-like structure.