公开(公告)号：US20250105074A1

公开(公告)日：2025-03-27

申请号：US18977572

申请日：2024-12-11

Applicant: Intel Corporation

Inventor： Bohan Shan ,  Haobo Chen ,  Wei Wei ,  Jose Fernando Waimin Almendares ,  Ryan Joseph Carrazzone ,  Kyle Jordan Arrington ,  Ziyin Lin ,  Dingying Xu ,  Hongxia Feng ,  Yiqun Bai ,  Hiroki Tanaka ,  Brandon Christian Marin ,  Jeremy Ecton ,  Benjamin Taylor Duong ,  Gang Duan ,  Srinivas Venkata Ramanuja Pietambaram ,  Rui Zhang ,  Mohit Gupta

IPC: H01L23/15 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498

Abstract: Glass cores including protruding through glass vias and related methods are disclosed herein. An example substrate disclosed herein includes a glass core including a surface and a copper through glass via (TGV) extending through the glass core, the TGV including a protrusion extending from the surface.

公开(公告)号：US20190002735A1

公开(公告)日：2019-01-03

申请号：US15637960

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Mohit Gupta ,  Anna M. Prakash ,  Vladimir Malamud ,  Mark Saltas ,  Ziv Belman

IPC: C09J7/02 ,  H01B1/02 ,  H01L23/36 ,  C09J1/00

Abstract: Aspects of the embodiments are directed to an optoelectronic device that includes one or more pressure sensitive adhesives to secure components during an assembly process. The optoelectronic device includes an electromagnetic interference/radio frequency interference shield. The shield can include an aperture for permitting light to enter a photodetector. An infrared filter can be secured to the shield using a pressure sensitive adhesive (PSA) film. The PSA film can be a templated film that is double sided. A PSA film can also be used to secure the shield to the printed circuit board (PCB) of the optoelectronic device. To promote electromagnetic conduction between the shield and the PCB, the PSA film can include additives. Aspects of the embodiments are directed to methods for assembling the optoelectronic device by picking and placing a PSA film and applying a pressure to certain components to activate the PSA film adhesion.