公开(公告)号：US20240164063A1

公开(公告)日：2024-05-16

申请号：US18394829

申请日：2023-12-22

Applicant: Intel Corporation

Inventor： Samarth Alva ,  Prakash Kurma Raju ,  Shivaraju Neerati ,  Navneet Singh ,  Ravishankar Srikanth

IPC: H05K7/20 ,  G06F1/16 ,  H05K5/02

CPC classification number: H05K7/20509 ,  G06F1/1681 ,  G06F1/1683 ,  H05K5/0226 ,  H05K5/0247

Abstract: An electronic device or a component thereof is described, which may include communication and/or thermal interconnects. The device may include hingedly coupled portions, where the interconnects are axially arranged (e.g., coincident) with respect to a hinge axis of the foldable electronic device.

公开(公告)号：US11206748B2

公开(公告)日：2021-12-21

申请号：US16713430

申请日：2019-12-13

Applicant: Intel Corporation

Inventor： Raghavendra Doddi ,  Ravishankar Srikanth ,  Kathiravan D ,  Prakash Kurma Raju

IPC: H05K7/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.

公开(公告)号：US20240098938A1

公开(公告)日：2024-03-21

申请号：US18526948

申请日：2023-12-01

Applicant: Intel Corporation

Inventor： Ravishankar Srikanth ,  Vijith Halestoph R ,  Prakash Kurma Raju ,  Arnab Sen ,  Isha Garg ,  Ezekiel Poulose ,  Avinash Manu Aravindan

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H05K7/20154 ,  H05K7/2039

Abstract: Techniques for a vapor chamber with less dead space are disclosed. In an illustrative embodiment, a vapor chamber is formed by folding a sheet and sealing the edges. The edges seal the vapor chamber but take up a relatively large amount of space without allowing for vapor to be transported in that space. The folded edge takes up less space, reducing the overall footprint of the vapor chamber. The vapor chamber with a smaller footprint can allow for, e.g., more space for motherboard area, more space for a battery, and/or a smaller form factor overall.