公开(公告)号：US20250014980A1

公开(公告)日：2025-01-09

申请号：US18219018

申请日：2023-07-06

Applicant: Intel Corporation

Inventor： Eric ERIKE ,  Anikki GIESSLER ,  Zhichao ZHANG ,  Srikant NEKKANTY ,  Saikat MONDAL

IPC: H01L23/498 ,  H01R12/52

Abstract: Embodiments disclosed herein include a liquid metal interposer. In an embodiment, the liquid metal interposer comprises a substrate with a first opening in the substrate and a second opening in the substrate. In an embodiment, a channel is between the first opening and the second opening. In an embodiment, the channel fluidically couples the first opening to the second opening.

公开(公告)号：US20250070491A1

公开(公告)日：2025-02-27

申请号：US18238381

申请日：2023-08-25

Applicant: Intel Corporation

Inventor： Saikat MONDAL ,  Zhichao ZHANG ,  Oluwafemi AKINWALE ,  Kemal AYGÜN

IPC: H01R12/71 ,  H01L23/00 ,  H01R13/24 ,  H01R13/405

Abstract: Embodiments disclosed herein include sockets and socket modules. In an embodiment, a socket module comprises a housing and a first pin through the housing in a first row of pins. In an embodiment, a second pin is through the housing in a second row of pins. In an embodiment, at least three intervening rows of pins are between the first row of pins and the second row of pins. In an embodiment, one or more pin locations in the at least three intervening rows of pins are depopulated.