公开(公告)号：US20250014980A1

公开(公告)日：2025-01-09

申请号：US18219018

申请日：2023-07-06

Applicant: Intel Corporation

Inventor： Eric ERIKE ,  Anikki GIESSLER ,  Zhichao ZHANG ,  Srikant NEKKANTY ,  Saikat MONDAL

IPC: H01L23/498 ,  H01R12/52

Abstract: Embodiments disclosed herein include a liquid metal interposer. In an embodiment, the liquid metal interposer comprises a substrate with a first opening in the substrate and a second opening in the substrate. In an embodiment, a channel is between the first opening and the second opening. In an embodiment, the channel fluidically couples the first opening to the second opening.

公开(公告)号：US20220208645A1

公开(公告)日：2022-06-30

申请号：US17696694

申请日：2022-03-16

Applicant: Intel Corporation

Inventor： Olaotan ELENITOBA-JOHNSON ,  Eric ERIKE ,  Jeffory L. SMALLEY ,  Ulises ENCARNACION ,  Ralph V. MIELE ,  Phil GENG ,  Sri Priyanka TUNUGUNTLA ,  Shaun G. IMMEKER

IPC: H01L23/40

Abstract: An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

公开(公告)号：US20240404896A1

公开(公告)日：2024-12-05

申请号：US18204212

申请日：2023-05-31

Applicant: Intel Corporation

Inventor： Eric ERIKE ,  Srikant NEKKANTY ,  Karumbu MEYYAPPAN ,  Anikki GIESSLER

IPC: H01L23/13 ,  H01L21/48 ,  H01L23/498

Abstract: Embodiments described herein include a liquid metal carrier. In an embodiment, the liquid metal carrier includes a substrate that is a polymer. In an embodiment, a first opening is provided through the substrate with a first shape, and a second opening is provided through the substrate with a second shape. In an embodiment, the first shape is different than the second shape.