公开(公告)号：US20250112140A1

公开(公告)日：2025-04-03

申请号：US18374609

申请日：2023-09-28

Applicant: Intel Corporation

Inventor： Rahul BHURE ,  Mitchell PAGE ,  Joseph PEOPLES ,  Jieying KONG ,  Nicholas S. HAEHN ,  Astitva TRIPATHI ,  Bainye Francoise ANGOUA ,  Yosef KORNBLUTH ,  Daniel ROSALES-YEOMANS ,  Joshua STACEY ,  Aaditya Anand CANDADAI ,  Yonggang Yong LI ,  Tchefor NDUKUM ,  Scott COATNEY ,  Gang DUAN ,  Jesse JONES ,  Srinivas Venkata Ramanuja PIETAMBARAM ,  Dilan SENEVIRATNE ,  Matthew ANDERSON

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/15

Abstract: Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a core with a first width, and the core comprises a glass layer. In an embodiment, a via is provided through a thickness of the core, where the via is electrically conductive. In an embodiment, a first layer is provided over the core, where the first layer comprises a second width that is smaller than the first width. In an embodiment, a second layer is provided under the core, where the second layer comprises a third width that is smaller than the first width.