公开(公告)号：US11906777B2

公开(公告)日：2024-02-20

申请号：US16797657

申请日：2020-02-21

Applicant: Intel Corporation

Inventor： John Heck ,  Lina He ,  Sungbong Park ,  Olufemi Isiade Dosunmu ,  Harel Frish ,  Kelly Christopher Magruder ,  Seth M. Slavin ,  Wei Qian ,  Ansheng Liu ,  Nutan Gautam ,  Mark Isenberger

IPC: G02B6/12 ,  H04J14/02 ,  G02B6/122

CPC classification number: G02B6/12007 ,  G02B6/12004 ,  G02B6/1228 ,  H04J14/02 ,  G02B2006/12061

Abstract: Embodiments may relate to a wavelength-division multiplexing (WDM) transceiver that has a silicon waveguide layer coupled with a silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may include a tapered portion that is coupled with the silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may be coupled with a first oxide layer with a first z-height, and the silicon nitride waveguide layer may be coupled with a second oxide layer with a second z-height that is greater than the first z-height. Other embodiments may be described or claimed.