公开(公告)号：US20170288780A1

公开(公告)日：2017-10-05

申请号：US15087344

申请日：2016-03-31

Applicant: Intel Corporation

Inventor： Myung Jin Yim ,  Quan A. Tran ,  SeungJae Lee ,  Sandeep Razdan ,  Yigit O. Yilmaz ,  Pradeep Srinivasan ,  Jincheng Wang ,  Ansheng Liu

IPC: H04B10/50 ,  H01S3/10 ,  H01S3/02 ,  H01S3/23

CPC classification number: H04B10/503 ,  H01L2224/73204 ,  H01S3/2375 ,  H01S5/021 ,  H01S5/02248 ,  H01S5/4087

Abstract: Apparatuses including integrated circuit (IC) optical assemblies and processes for fabrication of IC optical assemblies are disclosed herein. In some embodiments, the IC optical assemblies include an optical transmitter component electrically coupled to a first portion of a packaging substrate. The IC optical assemblies further include an optical transmitter driver component between the optical transmitter component and a second portion of the packaging substrate, wherein a first side of the optical transmitter driver component is electrically coupled to the optical transmitter component. The IC optical assemblies further include a plurality of bumps between a second side of the optical transmitter driver component and proximate the second portion of the packaging substrate, wherein the plurality of bumps are not directly coupled to the optical transmitter driver component.