公开(公告)号：US20240332112A1

公开(公告)日：2024-10-03

申请号：US18744108

申请日：2024-06-14

申请人： Intel Corporation

发明人： Susmriti Das Mahapatra ,  Malavarayan Sankarasubramanian ,  Shenavia Howell ,  John Harper ,  Mitul Modi

IPC分类号： H01L23/36 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L21/768 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/488

CPC分类号： H01L23/36 ,  H01L21/4814 ,  H01L21/50 ,  H01L21/76838 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/488 ,  H01L23/562 ,  H01L2021/60135

摘要： An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10−6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

公开(公告)号：US20220102234A1

公开(公告)日：2022-03-31

申请号：US17033080

申请日：2020-09-25

申请人： Intel Corporation

发明人： Susmriti Das Mahapatra ,  Malavarayan Sankarasubramanian ,  Shenavia Howell ,  John Harper ,  Mitul Modi

IPC分类号： H01L23/36 ,  H01L23/488 ,  H01L23/00 ,  H01L21/50 ,  H01L21/768

摘要： An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10−6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

公开(公告)号：US12040246B2

公开(公告)日：2024-07-16

申请号：US17033080

申请日：2020-09-25

申请人： Intel Corporation

发明人： Susmriti Das Mahapatra ,  Malavarayan Sankarasubramanian ,  Shenavia Howell ,  John Harper ,  Mitul Modi

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L21/50 ,  H01L21/768 ,  H01L23/00 ,  H01L23/36 ,  H01L23/373 ,  H01L23/42 ,  H01L23/488 ,  H01L21/60

CPC分类号： H01L23/36 ,  H01L21/4814 ,  H01L21/50 ,  H01L21/76838 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/488 ,  H01L23/562 ,  H01L2021/60135

摘要： An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10−6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.