公开(公告)号：US20200335432A1

公开(公告)日：2020-10-22

申请号：US16388136

申请日：2019-04-18

申请人： Intel Corporation

发明人： Gregorio R. Murtagian ,  Jeffory L. Smalley ,  Thomas T. Holden ,  Silver A. Estrada Rodriguez ,  Luis E. Rosales Galvan

IPC分类号： H01L23/498 ,  H01L21/67 ,  H05K1/18

摘要： A circuit board assembly includes at least one circuit board having a plurality of conductive layers, the at least one circuit board having a first face and an opposite second face. A first chip socket on the first face is positioned opposite of a second chip socket on the second face. In one example, each chip socket can receive a processor. The first and second chip sockets may be arranged in a mirrored fashion with respect to one another, or an overlapping but non-mirrored fashion. In any such arrangements, as fasteners are tightened to fully seat first and second chips respectively installed in the first and second chip sockets, forces applied to the first chip effectively neutralize or otherwise reduce opposing forces applied to the second chip, thereby reducing circuit board deflection.