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公开(公告)号:US11063088B2
公开(公告)日:2021-07-13
申请号:US16706470
申请日:2019-12-06
Applicant: Intel Corporation
Inventor: Daniel Ouellette , Christopher Wiegand , Justin Brockman , Tofizur Rahman , Oleg Golonzka , Angeline Smith , Andrew Smith , James Pellegren , Aaron Littlejohn , Juan G. Alzate-Vinasco , Yu-Jin Chen , Tanmoy Pramanik
Abstract: A memory device includes a first electrode, a second electrode and a magnetic tunnel junction (MTJ) between the first electrode and the second electrode. The MTJ includes a fixed magnet, a free magnet and a tunnel barrier between the fixed magnet and the free magnet. The MTJ further includes a conductive layer between the free magnet and the second electrode, the conductive layer having a metallic dopant, where the metallic dopant has a concentration that increase with distance from an interface between the free magnet and the conductive layer. A capping layer is between the conductive layer and the second electrode.
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公开(公告)号:US20210175284A1
公开(公告)日:2021-06-10
申请号:US16706470
申请日:2019-12-06
Applicant: Intel Corporation
Inventor: Daniel Ouellette , Christopher Wiegand , Justin Brockman , Tofizur Rahman , Oleg Golonzka , Angeline Smith , Andrew Smith , James Pellegren , Aaron Littlejohn , Juan G. Alzate-Vinasco , Yu-Jin Chen , Tanmoy Pramanik
Abstract: A memory device includes a first electrode, a second electrode and a magnetic tunnel junction (MTJ) between the first electrode and the second electrode. The MTJ includes a fixed magnet, a free magnet and a tunnel barrier between the fixed magnet and the free magnet. The MTJ further includes a conductive layer between the free magnet and the second electrode, the conductive layer having a metallic dopant, where the metallic dopant has a concentration that increase with distance from an interface between the free magnet and the conductive layer. A capping layer is between the conductive layer and the second electrode.
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