公开(公告)号：US20250107195A1

公开(公告)日：2025-03-27

申请号：US18373466

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Leonard P. GULER ,  Thomas O’BRIEN ,  Anindya DASGUPTA ,  Shengsi LIU ,  Saurabh ACHARYA ,  Charles H. WALLACE ,  Baofu ZHU

IPC: H01L29/40 ,  H01L29/08 ,  H01L29/417 ,  H01L29/775 ,  H01L29/786

Abstract: Integrated circuit structures having trench contact flyover structures, and methods of fabricating integrated circuit structures having trench contact flyover structures, are described. For example, an integrated circuit structure includes a plurality of horizontally stacked nanowires or a fin. A gate structure is over the plurality of horizontally stacked nanowires or the fin. An epitaxial source or drain structure is at an end of the plurality of horizontally stacked nanowires or the fin. A conductive trench contact structure has a first portion laterally spaced apart from the epitaxial source or drain structure, a second portion vertically over the epitaxial source or drain structure, and a third portion between the first portion and the second portion. A dielectric plug is laterally between the epitaxial source or drain structure and the first portion of the conductive trench contact structure, wherein the third portion of the conductive trench contact structure is vertically over the dielectric plug.

公开(公告)号：US20240421201A1

公开(公告)日：2024-12-19

申请号：US18336323

申请日：2023-06-16

Applicant: Intel Corporation

Inventor： Leonard P. GULER ,  Thomas O’BRIEN ,  Charles H. WALLACE ,  Anindya DASGUPTA

IPC: H01L29/417 ,  H01L29/06 ,  H01L29/08 ,  H01L29/40 ,  H01L29/423 ,  H01L29/778 ,  H01L29/786

Abstract: Embodiments described herein may be related to apparatuses, processes, systems, and/or techniques for creating flyover trench connectors within a transistor structure, where a first portion of the trench connector is electrically coupled with a first epitaxial structure and where a second portion of the trench connector extends above but is not electrically coupled with a second epitaxial structure. Other embodiments may be described and/or claimed.