公开(公告)号：US20240194552A1

公开(公告)日：2024-06-13

申请号：US18587331

申请日：2024-02-26

Applicant: Intel Corporation

Inventor： Lizabeth KESER ,  Bernd WAIDHAS ,  Thomas ORT ,  Thomas WAGNER

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/522

CPC classification number: H01L23/3114 ,  H01L21/568 ,  H01L23/5226 ,  H01L24/11 ,  H01L24/14 ,  H01L24/96 ,  H01L28/10 ,  H01L28/40 ,  H01L2224/02379 ,  H01L2924/19011

Abstract: A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.

公开(公告)号：US20220336306A1

公开(公告)日：2022-10-20

申请号：US17855674

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Lizabeth KESER ,  Bernd WAIDHAS ,  Thomas ORT ,  Thomas WAGNER

IPC: H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.