公开(公告)号：US20250132239A1

公开(公告)日：2025-04-24

申请号：US19005161

申请日：2024-12-30

Applicant: Intel Corporation

Inventor： Hongxia Feng ,  Thomas Stanley Heaton ,  Shayan Kaviani ,  Yonggang Li ,  Mahdi Mohammadighaleni ,  Bai Nie ,  Dilan Seneviratne ,  Joshua James Stacey ,  Hiroki Tanaka ,  Elham Tavakoli ,  Ehsan Zamani

IPC: H01L23/498

Abstract: Porous liners for through-glass vias and associated methods are disclosed. An example apparatus includes a glass layer having a through-hole. The example apparatus further includes a conductive material within the through-hole. The example apparatus also includes a porous material between at least a portion of the conductive material and at least a portion of a sidewall of the through-hole.