公开(公告)号：US20180372551A1

公开(公告)日：2018-12-27

申请号：US15629625

申请日：2017-06-21

Applicant: Intel Corporation

Inventor： Janusz P. Jurski ,  Tozer J. Bandorawalla ,  Ramkumar Nagappan ,  Mariusz Oriol ,  Piotr Sawicki ,  Robin A. Steinbrecher ,  Shankar Krishnan

IPC: G01K3/08 ,  F24F11/00

Abstract: An apparatus is provided which comprises: a first circuitry to receive a measurement of a first temperature of a section of a computing device during a first loading condition of the computing device, and to receive a measurement of a second temperature of the section of the computing device during a second loading condition of the computing device; and a second circuitry to detect a potential fault in a cooling system to cool the computing device, based at least in part on the first temperature and the second temperature.

公开(公告)号：US11061460B2

公开(公告)日：2021-07-13

申请号：US16457354

申请日：2019-06-28

Applicant: Intel Corporation

Inventor： Fuat Keceli ,  Tozer J. Bandorawalla ,  Grant McFarland ,  Jonathan M. Eastep ,  Federico Ardanaz

IPC: G06F1/3203 ,  G06F1/3206 ,  G06F1/3234 ,  G06F1/3296

Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for Thermal Design Power (TDP) rebalancing among thermally-coupled processors and non-thermally-coupled processors, providing computing efficiency or homogeneity with respect to, including but not limited to, thermal requirements, power consumption, and processor operations. The TDP rebalancing may include implementing management circuitry and configuration control circuitry. Other embodiments may be described and claimed.

公开(公告)号：US10431475B2

公开(公告)日：2019-10-01

申请号：US15595765

申请日：2017-05-15

Applicant: Intel Corporation

Inventor： Tozer J. Bandorawalla ,  Mark E. Sprenger

IPC: G06F1/20 ,  H01L21/48 ,  H01L23/473 ,  H05K1/02

Abstract: Apparatuses, systems and methods associated with design of cold plates for cooling electrical systems are disclosed herein. In embodiments, a cold plate may include a base and a lid affixed to a side of the base via a braze joint, wherein the braze joint may extend around a perimeter of the lid. The lid may include a dam having a perimeter located inside of the perimeter of the lid, wherein the dam may be compressed against the side of the base and may be liquid-tight to the side of the base, and wherein a cavity may be located between the base and the lid within the perimeter of the dam to provide a circulation passage for a liquid coolant. Other embodiments may be described and/or claimed.