公开(公告)号：US10545546B2

公开(公告)日：2020-01-28

申请号：US15904291

申请日：2018-02-23

Applicant: Intel Corporation

Inventor： Krishnakumar Varadarajan ,  Mark Angus MacDonald ,  Srinivasarao Konakalla

IPC: G06F1/20 ,  G06F1/3203 ,  F25B25/00 ,  F25B27/00 ,  H05K7/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to receive data related to thermal properties of a first heat source, activate an air mover based on the received data related to the thermal properties of the first heat source, where a majority of the air moved by the air mover is biased in a first direction, determine that the majority of the air should have a bias in a second direction, and reverse a direction of rotation of the air mover to cause the air moved by the air mover to have a bias in the second direction. In an example, the first direction towards the first heat source and the second direction is opposite the first direction and towards a second heat source.

公开(公告)号：US20240431066A1

公开(公告)日：2024-12-26

申请号：US18340577

申请日：2023-06-23

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Chi Chou Cheng ,  Jeffrey Ho ,  Chih-Tsung Hu ,  Srinivasarao Konakalla ,  Tsung-Kai Lin ,  Arnab Sen ,  Chiu-Chun Wang ,  Jiacheng Wu

IPC: H05K7/20 ,  G06F1/20

Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.

公开(公告)号：US20190041924A1

公开(公告)日：2019-02-07

申请号：US15904291

申请日：2018-02-23

Applicant: Intel Corporation

Inventor： Krishnakumar Varadarajan ,  Mark Angus MacDonald ,  Srinivasarao Konakalla

IPC: G06F1/20 ,  F25B27/00 ,  F25B25/00 ,  G06F1/32 ,  H05K7/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to receive data related to thermal properties of a first heat source, activate an air mover based on the received data related to the thermal properties of the first heat source, where a majority of the air moved by the air mover is biased in a first direction, determine that the majority of the air should have a bias in a second direction, and reverse a direction of rotation of the air mover to cause the air moved by the air mover to have a bias in the second direction. In an example, the first direction towards the first heat source and the second direction is opposite the first direction and towards a second heat source.

公开(公告)号：US20240410396A1

公开(公告)日：2024-12-12

申请号：US18329763

申请日：2023-06-06

Applicant: Intel Corporation

Inventor： Arnab Sen ,  Srinivasarao Konakalla ,  Samarth Alva ,  Amit Kumar ,  Rachit Garg ,  Bhavaneeswaran Anbalagan ,  Raghavendra S. Kanivihalli ,  Prasanna Pichumani

IPC: F04D29/66 ,  F04D17/16 ,  F04D25/08 ,  F04D29/28 ,  G06F1/20

Abstract: Impeller architecture for a cooling fan and methodology for making same. The impeller architecture includes a plurality of blades, individual ones of the blades have a first end that is attached to a hub component in a sequential order, such that sequential first ends are attached to the circumference. An indexing function is applied to the sequential order, and blades or the spaces therebetween are modified accordingly to have a blade type based on their sequential location and the indexing function. The indexing function can be, in a non-limiting example, odd numbers or prime numbers.

公开(公告)号：US11895803B2

公开(公告)日：2024-02-06

申请号：US16914311

申请日：2020-06-27

Applicant: INTEL CORPORATION

Inventor： Krishnakumar Varadarajan ,  Arvind Sundaram ,  Srinivasarao Konakalla ,  Yogesh Channaiah ,  Satyajit Siddharay Kamat ,  Raghavendra N

IPC: H05K7/20 ,  F04D25/06 ,  F04D29/58 ,  F04D17/16 ,  G06F1/20 ,  F04D29/28

CPC classification number: H05K7/20172 ,  F04D17/16 ,  F04D25/0606 ,  F04D29/281 ,  F04D29/5806 ,  F04D29/5813 ,  G06F1/203

Abstract: Particular embodiments described herein provide for an electronic device that includes a fan. The fan can include a center shaft, fan blades that extend from the center shaft, and a plurality of magnets on an outside portion of at least two of the fan blades, where stator coils interact with the magnets to drive the blades around the center shaft. The center shaft and fan blades are a single component from the same material. In some examples, the center shaft and fan blades were created using a metal injection molding process.