公开(公告)号：US20240365513A1

公开(公告)日：2024-10-31

申请号：US18394503

申请日：2023-12-22

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Ying-Feng PANG ,  Vishnu Prasadh SUGUMAR

IPC: H05K7/20 ,  F25B5/02 ,  F25B49/02 ,  G06F1/20

CPC classification number: H05K7/20381 ,  F25B5/02 ,  F25B49/022 ,  G06F1/206 ,  H05K7/20309 ,  H05K7/20327 ,  F25B2700/191 ,  F25B2700/197 ,  F25B2700/2108 ,  F25B2700/21174 ,  F25B2700/21175

Abstract: An apparatus and method for cooling a computing system, comprising a plurality of electronic components, with a cooling system. The cooling system includes a closed loop for the two-phase coolant, wherein the two-phase coolant has a saturation temperature. The closed loop includes a valve fluidly connected between an outlet of a heat exchanger and an inlet of a plurality of evaporator structures configured to be thermally coupled to the plurality of electronic components, and a compressor fluidly connected between an outlet of the plurality of evaporator structures and an inlet of the heat exchanger. The apparatus and method for the cooling system are configured to monitor one or more system temperatures of the computing system and adjust an operation of at least one of the valve or the compressor to alter the saturation temperature based on the one or more system temperatures.