公开(公告)号：US20230189442A1

公开(公告)日：2023-06-15

申请号：US18015702

申请日：2020-09-16

Applicant: Intel Corporation

Inventor： Kaladhar RADHAKRISHNAN ,  Wei SHEN

IPC: H05K1/18 ,  H05K1/02 ,  H01L25/16

CPC classification number: H05K1/183 ,  H05K1/0209 ,  H01L25/162 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10734 ,  H01L24/16

Abstract: Embodiments disclosed herein include microelectronic boards and electronic systems. In an embodiment, a microelectronic board comprises aboard substrate, where the board substrate has a first thickness between a first surface and a second surface opposite from the first surface. In an embodiment, a recess is formed into the first surface of the board substrate, where the recess comprises a third surface between the first surface and the second surface. In an embodiment, the board substrate has a second thickness between the third surface and the second surface. In an embodiment, the microelectronic board further comprises a voltage regulator (VR) module attached to the third surface.