公开(公告)号：US12057413B2

公开(公告)日：2024-08-06

申请号：US16393047

申请日：2019-04-24

Applicant: Intel Corporation

Inventor： Lijiang Wang ,  Jianyong Xie ,  Arghya Sain ,  Xiaohong Jiang ,  Sujit Sharan ,  Kemal Aygun

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L2223/6638 ,  H01L2224/16225 ,  H01L2924/30111

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a first trace embedded in a package substrate. In an embodiment, the first trace comprises a first region, where the first region has a first width, and a second region, where the second region has a second width that is smaller than the first width.