INTERCONNECT BRIDGE CIRCUITRY DESIGNS FOR INTEGRATED CIRCUIT PACKAGE SUBSTRATES

    公开(公告)号:US20240332193A1

    公开(公告)日:2024-10-03

    申请号:US18192804

    申请日:2023-03-30

    CPC classification number: H01L23/5381 H01L23/5386

    Abstract: In one embodiment, an interconnect bridge circuitry includes a first set of bridge-to-die electrical connectors in a first region of the circuitry, a second set of bridge-to-die electrical connectors in a second region of the circuitry, and an interconnection between a bridge-to-die connector of the first set and a bridge-to-die connector of the second set. The interconnection is in a third region of the circuitry between the first region and the second region, and includes a first trace connected to the bridge-to-die electrical connector of the first set, a second trace connected to the bridge-to-die electrical connector of the second set, the second trace parallel with the first trace, and a third trace connected between the first trace and the second trace.

    Signal routing carrier
    3.
    发明授权

    公开(公告)号:US11114394B2

    公开(公告)日:2021-09-07

    申请号:US16536997

    申请日:2019-08-09

    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes an article having a substrate, a semiconductor die thereon, a routing carrier attached to the substrate, and a transmission pathway electrically connected to the semiconductor die and the substrate, wherein the transmission pathway runs through the routing carrier. In selected examples, the article is made by manufacturing a substrate, attaching a semiconductor die to the substrate, fabricating a routing carrier comprising a transmission pathway, and integrating the routing carrier into the substrate.

    SIGNAL ROUTING CARRIER
    4.
    发明申请

    公开(公告)号:US20210043588A1

    公开(公告)日:2021-02-11

    申请号:US16536997

    申请日:2019-08-09

    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes an article having a substrate, a semiconductor die thereon, a routing carrier attached to the substrate, and a transmission pathway electrically connected to the semiconductor die and the substrate, wherein the transmission pathway runs through the routing carrier. In selected examples, the article is made by manufacturing a substrate, attaching a semiconductor die to the substrate, fabricating a routing carrier comprising a transmission pathway, and integrating the routing carrier into the substrate.

    INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS

    公开(公告)号:US20240006323A1

    公开(公告)日:2024-01-04

    申请号:US17853018

    申请日:2022-06-29

    CPC classification number: H01L23/5381 H01L23/5386 H01L23/5383 H01L25/0655

    Abstract: An electronic device may include an interconnect bridge. The interconnect bridge may include a first electrical routing trace having a first routing length and a corresponding first transit time for a first electrical signal to transmit across the first routing length. The first electrical routing trace may transmit the first electrical signal along a major plane of the interconnect bridge between a first interconnect and a second interconnect. The interconnect bridge may include a routing trace deviation in communication with the first electrical routing trace. The routing trace deviation is outside a direct route between the first interconnect and the second interconnect. The routing trace deviation may alter one or more of capacitance or resistance of the first electrical routing trace and correspondingly alter the first routing time.

Patent Agency Ranking