公开(公告)号：US20240363490A1

公开(公告)日：2024-10-31

申请号：US18140146

申请日：2023-04-27

申请人： Intel Corporation

发明人： Mohammad Enamul KABIR ,  Keith ZAWADZKI ,  Rahim KASIM ,  Sunny CHUGH ,  Zhizheng ZHANG ,  Christopher M. PELTO ,  Babita DHAYAL ,  John Kevin TAYLOR ,  Doug INGERLY

IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/498 ,  H01L23/58 ,  H01L29/06

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L23/49827 ,  H01L23/585 ,  H01L24/16 ,  H01L29/0619 ,  H01L2224/16225

摘要： Through-silicon via dies are described. In an example, a semiconductor die includes a substrate having a device side and a backside. An active device layer is in or on the device side of the substrate. A dielectric structure is over the active device layer. A first die-edge metal guard ring is in the dielectric structure and around an outer perimeter of the substrate. A plurality of metallization layers is in the dielectric structure and within the first die-edge metal guard ring. A plurality of through silicon vias is in the substrate and extend into the dielectric structure and are connected to the plurality of metallization layers. A plurality of backside metallization structures is beneath the backside of the substrate. The plurality of through silicon vias are connected to the plurality of backside metallization structures. A second die-edge metal guard ring is laterally around the plurality of backside metallization structures.