Low Resistivity Nitrogen-Doped Zinc Telluride and Methods for Forming the Same
    1.
    发明申请
    Low Resistivity Nitrogen-Doped Zinc Telluride and Methods for Forming the Same 审中-公开
    低电阻率氮掺杂锌碲化物及其形成方法

    公开(公告)号:US20150171260A1

    公开(公告)日:2015-06-18

    申请号:US14108697

    申请日:2013-12-17

    CPC classification number: H01L31/1828 H01L31/02963 H01L31/073 Y02E10/543

    Abstract: Embodiments provided herein describe methods for forming nitrogen-doped zinc telluride, such as for use in photovoltaic devices. The zinc telluride layer is formed using physical vapor deposition (PVD) at a processing temperature of between about 100° C. and about 450° C. in a gaseous environment that includes between about 3% and about 10% by volume of nitrogen gas.

    Abstract translation: 本文提供的实施方案描述了形成氮掺杂的碲化锌的方法,例如用于光伏器件中的方法。 在包括约3体积%至约10体积%的氮气的气体环境中,使用物理气相沉积(PVD)在约100℃至约450℃的加工温度下形成碲化锌层。

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