公开(公告)号：US12004307B2

公开(公告)日：2024-06-04

申请号：US17342626

申请日：2021-06-09

Applicant: International Business Machines Corporation

Inventor： Colin Edward Masterson ,  John R. Dangler ,  Tory Johnson ,  Austin Carter ,  Gunnar Mills

IPC: H05K3/22 ,  H05K3/06

CPC classification number: H05K3/225 ,  H05K3/064 ,  H05K3/068 ,  H05K2203/0126 ,  H05K2203/0746 ,  H05K2203/0753 ,  H05K2203/0766 ,  H05K2203/175

Abstract: Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

公开(公告)号：US10960463B2

公开(公告)日：2021-03-30

申请号：US16190943

申请日：2018-11-14

Applicant: International Business Machines Corporation

Inventor： John R. Dangler ,  Austin Carter ,  Gunnar Mills ,  Colin E. Masterson

IPC: B22D19/00 ,  B22D17/20 ,  C22C18/04

Abstract: The present disclosure describes embedding thermally-resistant flexible cabling within a metal casting during die-casting. A die-casting process may include fixing the thermally-resistant flexible cabling within a die, and die-casting the metal to form a metal casting having the thermally-resistant flexible cabling embedded within the metal casting. In some cases, the thermally-resistant flexible cabling may be utilized for grounding of the metal casting.