公开(公告)号：US20030127686A1

公开(公告)日：2003-07-10

申请号：US10039200

申请日：2002-01-04

Applicant: INTERSIL AMERICAS INC.

Inventor： Rex Everett Lowther ,  William R. Young

IPC: H01L029/76

CPC classification number: H01L28/10 ,  H01F17/0013 ,  H01F27/367 ,  H01L23/5223 ,  H01L23/5225 ,  H01L23/5227 ,  H01L27/08 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a substrate, a main metal layer and a shield. The substrate has a working surface. The main metal layer has at least one pair of current path regions. Each of the current path region pairs is formed in generally a regular polygonal shape that is generally symmetric about a plane of symmetry that is perpendicular to the working surface of the substrate. The shield is patterned into segments that are generally symmetric about the plane of symmetry. Medial portions of at least some segments of the shield are formed generally perpendicular to the plane of symmetry as the medial portions cross the plane of symmetry.

公开(公告)号：US20040038473A1

公开(公告)日：2004-02-26

申请号：US10645709

申请日：2003-08-21

Applicant: Intersil Americas Inc.

Inventor： Rex Everett Lowther ,  William R. Young

IPC: H01L021/8238

CPC classification number: H01L28/10 ,  H01F17/0013 ,  H01F27/367 ,  H01L23/5223 ,  H01L23/5225 ,  H01L23/5227 ,  H01L27/08 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to integrated circuits having symmetric inducting devices with a ground shield. In one embodiment, a symmetric inducting device for an integrated circuit comprises a substrate, a main metal layer and a shield. The substrate has a working surface. The main metal layer has at least one pair of current path regions. Each of the current path region pairs is formed in generally a regular polygonal shape that is generally symmetric about a plane of symmetry that is perpendicular to the working surface of the substrate. The shield is patterned into segments that are generally symmetric about the plane of symmetry. Medial portions of at least some segments of the shield are formed generally perpendicular to the plane of symmetry as the medial portions cross the plane of symmetry.

Abstract translation: 本发明涉及具有接地屏蔽的对称感应装置的集成电路。 在一个实施例中，用于集成电路的对称感应装置包括基板，主金属层和屏蔽。 基板具有工作表面。 主金属层具有至少一对电流通路区域。 每个电流通路区域对形成为大致对称的大致对称的正交多边形形状，该对称平面垂直于衬底的工作表面。 屏蔽被图案化成通常对称平面对称的段。 当中间部分穿过对称平面时，屏蔽件的至少一些部分的中间部分大致垂直于对称平面形成。

公开(公告)号：US20040007760A1

公开(公告)日：2004-01-15

申请号：US10194496

申请日：2002-07-11

Applicant: INTERSIL AMERICAS INC.

Inventor： Rex Everett Lowther

IPC: H01L029/00

CPC classification number: H01L28/10 ,  H01L27/08

Abstract: Inducting devices having a patterned ground shield with ribbing in an integrated circuit. In one embodiment, an inducting device comprises conductive turns to conduct current, a shield layer and a plurality of ribs. The shield layer is formed a select distance from the conductive turns. The shield layer is patterned into sections of shield to prevent eddy currents. The plurality of ribs are formed from a conductive layer that is positioned between the conductive turns and shield layer. Each rib is electrically coupled to a single associated section of shield. Moreover, each rib is more conductive than its associated section of shield to provide a less resistive current path than its associated section of shield.

Abstract translation: 在集成电路中具有带肋的图案化接地屏蔽的感应装置。 在一个实施例中，感应装置包括导电匝以传导电流，屏蔽层和多个肋。 屏蔽层形成在距导电圈的选定距离处。 屏蔽层被图案化成屏蔽部分以防止涡流。 多个肋由位于导电圈和屏蔽层之间的导电层形成。 每个肋电耦合到单个相关联的屏蔽部分。 此外，每个肋比其相关联的屏蔽部分更加导电，以提供比其相关联的屏蔽部分更小的电阻电流路径。